• DocumentCode
    2910183
  • Title

    Multi-protocol embedded PCS IP in a FPGA-SOC

  • Author

    Venkata, Ramanand ; Chan, Vinson ; Ton, Binh ; Lee, Chong ; Ngo, Huy ; Kabani, Malik ; Nguyen, Tam ; Zaliznyak, Arch ; Xue, Ning ; Shen, Steven ; Zheng, Michael ; Lai, Michael ; Park, Steve ; Chan, Lana ; Vijayaraghavan, Divya ; Lam, John ; Patel, Rakesh

  • Author_Institution
    Altera Corp., San Jose, CA
  • fYear
    2005
  • fDate
    21-21 Sept. 2005
  • Firstpage
    783
  • Lastpage
    786
  • Abstract
    Several strategies that were employed for developing next-generation embedded Hard IP are reviewed. Mixed signal Hard IP developed for a multi-protocol serial interface physical layer at 0.622Gbps to 3.125Gbps was redeployed for 0.622Gbps to 6.375Gbps data rates. Ensuring quality meant adopting a strongly modular approach to design and verification. The configuration space of the Hard IP had to be bounded intelligently. Major architectural enhancements were necessary instead of a simple performance upgrade of the previous Hard IP. Verification complexity mandated design and verification re-use. Emulation and vendor soft IF interoperability testing was another strategy employed for first silicon success
  • Keywords
    IP networks; embedded systems; field programmable gate arrays; integrated circuit design; integrated circuit testing; protocols; system-on-chip; 0.622 to 6.375 Gbit/s; FPGA; IF interoperability testing; SOC; emulation; multi-protocol embedded PCS IP; multi-protocol serial interface physical layer; next-generation embedded hard IP; vendor soft; verification complexity mandated design; verification re-use; Emulation; Field programmable gate arrays; Memory management; Optical packet switching; Optical switches; Personal communication networks; Physical layer; Silicon; Technological innovation; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2005. Proceedings of the IEEE 2005
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7803-9023-7
  • Type

    conf

  • DOI
    10.1109/CICC.2005.1568785
  • Filename
    1568785