• DocumentCode
    2910458
  • Title

    MSL heatshield development: From failure to success

  • Author

    Slimko, Eric ; Szalai, Christine ; Hoffman, Pamela

  • Author_Institution
    Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
  • fYear
    2011
  • fDate
    5-12 March 2011
  • Firstpage
    1
  • Lastpage
    9
  • Abstract
    Mars Science Laboratory is a scientific mission that places a 900 kg rover with 10 science instruments on the surface of Mars. A key component for landing on the surface of Mars is the aeroshell, which decelerates the entry vehicle to just 1% of its initial kinetic energy at atmospheric entry. The forward portion of the aeroshell is the heatshield which must be designed to withstand the pressure, heating, and shear stresses it experiences during the atmospheric deceleration process. The original exterior material chosen for the heatshield, SLA-561V, was the material used on all previous Mars aeroshells but required new qualification testing. Unfortunately, the material failed the more extreme environment 3 months after the aeroshell and project Critical Design Reviews. A rapid decision was required to switch to another material under test by the Orion program call Phenolic Impregnated Carbon Ablator (PICA). With 18 months left to design, fabricate, test, and deliver this new heatshield for the MSL 2009 launch opportunity, the PICA heatshield team had to rapidly respond to the challenge and work in a manner that ensured success. This paper discusses the lessons learned from the original SLA-561V design implementation and the process used to ensure the success of the PICA design implementation.
  • Keywords
    Mars; aerospace instrumentation; shells (structures); space vehicles; MSL heatshield development; Mars science laboratory; PICA; SLA-561V; aeroshell; atmospheric entry; phenolic impregnated carbon ablator; science instruments; scientific mission; Billets; Heating; Mars; Qualifications; Tiles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace Conference, 2011 IEEE
  • Conference_Location
    Big Sky, MT
  • ISSN
    1095-323X
  • Print_ISBN
    978-1-4244-7350-2
  • Type

    conf

  • DOI
    10.1109/AERO.2011.5747500
  • Filename
    5747500