DocumentCode
2912485
Title
The welding tendency of CuCr contact materials in vacuum
Author
Miao, Baihe ; Zhang, Yan ; He, Jianping ; Liu, Guoxun ; Wenbin Wang ; Li, Gang ; Wan, Xiaojun
Author_Institution
Univ. of Sci. & Technol. Beijing, Beijing, China
fYear
2010
fDate
Aug. 30 2010-Sept. 3 2010
Firstpage
265
Lastpage
268
Abstract
Diffusion welding tests of vacuum casting Cu-30Cr, Cu-30CrZr, Cu-30CrTe and Cu-30CrZrTe alloy contact materials as well as sintered CuCr25 p/m contact materials were performed in the vacuum chamber of Gleeble 3500, and the joining forces of the welded pairs were measured by tensile test at ambient temperature. Characteristics of fracture surfaces were analyzed by optical microscope and SEM. It shows that the joining force and strength decrease in the order of Cu-30CrZr, Cu-30Cr, Cu-30CrZrTe, CuCr25 and Cu-30CrTe contact materials; fractographs of these contact materials show different fracture mechanisms. These results show that the joining force of the welded specimen depends mainly on the bonding force of the interface of Cr and Cu phases. Therefore, the modified structure and behavior of the interface of Cu/Cr phases by adding micro-alloying Te to decrease properly the bonding force of interface of Cr/ Cu phases will crucially improve the welding behavior of Cu-Cr alloy contact materials. Thereby, the possibility to improve the anti-welding property of available CuCr contact materials further and the potential fusion-welding problem of some VCB with lower contact force are discussed.
Keywords
chromium compounds; copper compounds; optical microscopes; vacuum casting; vacuum circuit breakers; welding; CuCr; SEM; bonding force; contact material; diffusion welding test; fractograph; optical microscope; potential fusion welding problem; vacuum casting; vacuum chamber; vacuum circuit breaker; welding; Copper; Force; Materials; Rough surfaces; Surface cracks; Surface roughness; Welding; CuCr contact materials; anti-welding property; diffusion welding; fractographs; joining force of welded specimen pairs;
fLanguage
English
Publisher
ieee
Conference_Titel
Discharges and Electrical Insulation in Vacuum (ISDEIV), 2010 24th International Symposium on
Conference_Location
Braunschweig
ISSN
1093-2941
Print_ISBN
978-1-4244-8367-9
Electronic_ISBN
1093-2941
Type
conf
DOI
10.1109/DEIV.2010.5625754
Filename
5625754
Link To Document