DocumentCode
2912632
Title
AlN epitaxial film on 6H-SiC(0001) using MOCVD for GHz-band SAW devices
Author
Uehara, K. ; Yang, C.-M. ; Furusho, T. ; Kim, S.-K. ; Kameda, S. ; Nakase, H. ; Nishino, S. ; Tsubouchi, K.
Author_Institution
Res. Inst. of Electr. Commun., Tohoku Univ., Sendai, Japan
Volume
1
fYear
2003
fDate
5-8 Oct. 2003
Firstpage
905
Abstract
Aluminum nitride (AlN)(0001) epitaxial films on 6H-silicon carbide (SiC)(0001) were successfully grown using metal-organic-chemical-vapor deposition (MO-CVD). Crack-free on the surface of AlN films were obtained without preannealing for removal of polishing-induced damage from the 6H-SiC(0001) substrate. The crack-free AlN films were grown at 1100°C under V-III ratio of 25000. A SAW device was fabricated on the AlN film using photolithography and reactive ion etching (RIE) techniques. The thickness of AlN film was 1.0 μm. The direction of SAW propagation was a-axis of AlN. The line and space of IDT was 0.6 μm. The center frequency was measured to be 2.747GHz. The phase velocity was calculated to be nearly equal 6600m/sec. The phase velocity in AlN(0001)/6H-SiC(0001) structure is larger than that of AlN(0001)/sapphire(0001) structure under same thickness and direction of SAW propagation.
Keywords
III-V semiconductors; MOCVD; acoustic wave propagation; aluminium compounds; photolithography; semiconductor epitaxial layers; sputter etching; surface acoustic wave transducers; surface morphology; vapour phase epitaxial growth; wide band gap semiconductors; 1 micron; 1100 degC; 2.747 GHz; 6H-SiC(0001) substrate; AlN; AlN epitaxial film; IDT; MOCVD; SAW device fabrication; SAW propagation; SiC; aluminum nitride (AlN)(0001) epitaxial films; interdigital transducer; metal organic chemical vapor deposition; phase velocity calculation; photolithography; reactive ion etching; sapphire(0001) structure; surface acoustic wave; surface cracks; Aluminum nitride; Atomic force microscopy; MOCVD; Radio frequency; Scanning electron microscopy; Silicon carbide; Substrates; Surface acoustic wave devices; Surface acoustic waves; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN
0-7803-7922-5
Type
conf
DOI
10.1109/ULTSYM.2003.1293546
Filename
1293546
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