• DocumentCode
    2915632
  • Title

    Design of multiple reaction systems for genetic analysis

  • Author

    Krishnan, M. ; Brahmasandra, S. ; Burke, D.T. ; Mastrangelo, C.H. ; Burns, M.A.

  • Author_Institution
    Dept. of Chem. Eng., Michigan Univ., Ann Arbor, MI, USA
  • fYear
    2001
  • fDate
    25-25 Jan. 2001
  • Firstpage
    397
  • Lastpage
    400
  • Abstract
    Heat-transfer considerations significantly constrain design of multiple reaction microdevices. We present a new methodology for design and fabrication of multiple reaction systems using the concept of heat integration. Heat integration is a design concept that strikes a balance between complete thermal isolation of individual thermal operations and power consumption in a multiple reaction device. It relies on the use of steady-state temperature gradients developed in the substrate, by the actuation of a single reaction chamber, to initiate several reactions at progressively lower temperatures. The use of thermal gradients in this manner eliminates power requirements to heat individual reactions, active temperature control of "passive" reaction chambers and power requirement for cooling. Complete thermal isolation on the other hand, requires higher power for device cooling but, unlike the case of heat integration, geometry of component placement is relatively unconstrained.
  • Keywords
    DNA; biochemistry; biological techniques; genetics; heat transfer; micromechanical devices; proteins; active temperature control; component placement; cooling; genetic analysis; heat integration; multiple reaction systems; power consumption; reaction chambers; steady-state temperature gradients; thermal gradients; Cooling; Equations; Genetics; Geometry; Heat transfer; Heating; Steady-state; Temperature control; Temperature sensors; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2001. MEMS 2001. The 14th IEEE International Conference on
  • Conference_Location
    Interlaken, Switzerland
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-5998-4
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2001.906560
  • Filename
    906560