• DocumentCode
    2917157
  • Title

    Ruggedization of MXM graphics modules

  • Author

    Straznicky, I.

  • Author_Institution
    Curtiss-Wright Controls Defense Solutions, Ottawa, ON, Canada
  • fYear
    2012
  • fDate
    10-12 Sept. 2012
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    MXM modules, used to package graphics processing devices for use in benign environments, have been tested for use in harsh environments typical of deployed defense and aerospace systems. Results show that specially mechanically designed MXM GP-GPU modules can survive these environments, and successfully provide the enormous processing capability offered by the latest generation of GPUs to harsh environment applications.
  • Keywords
    graphics processing units; MXM GP-GPU modules; MXM graphics module ruggedization; aerospace systems; defense systems; general purpose graphics processor units; graphics processing devices; Connectors; Contacts; Electric shock; Humidity; Testing; Vehicles; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Performance Extreme Computing (HPEC), 2012 IEEE Conference on
  • Conference_Location
    Waltham, MA
  • Print_ISBN
    978-1-4673-1577-7
  • Type

    conf

  • DOI
    10.1109/HPEC.2012.6408666
  • Filename
    6408666
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2917157