DocumentCode
292117
Title
Miniaturized SAW filters using a flip-chip technique
Author
Yatsuda, H. ; Horishima, T. ; Eimura, T. ; Ooiwa, T.
Volume
1
fYear
1994
fDate
Oct. 31 1994-Nov. 3 1994
Firstpage
159
Abstract
This paper describes a miniature SAW filter, 3.2×2.5×0.9 mm3, which is applicable for RF-stage filters in mobile phones. The SAW filter is reduced in size by using a flip-chip assembly technique. The technique uses gold bumps on the SAW chip and gold-gold thermosonic face-down bonding. This bonding provides that a SAW chip is fixed mechanically and connected electrically with a package. A frequency response of a 950 MHz flip-chip SAW filter and results of reliability tests are shown
Keywords
UHF filters; cordless telephone systems; flip-chip devices; frequency response; microassembling; mobile radio; reliability; surface acoustic wave filters; surface mount technology; 950 MHz; Au; Au bumps; Au-Au thermosonic face-down bonding; RF-stage filters; assembly technique; flip-chip technique; frequency response; miniaturized SAW filters; mobile phones; package; reliability tests; Assembly systems; Bonding; Portable radio communication; Reliability testing; Surface acoustic wave filters; Surface mounting; UHF filters;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 1994. Proceedings., 1994 IEEE
Conference_Location
Cannes, France
Print_ISBN
0-7803-2012-3
Type
conf
DOI
10.1109/ULTSYM.1994.401572
Filename
401572
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