Wire bonding of aluminum/polyimide multi-layer structures

Author

Murali, V. ; Gasparek, M. ; Bhansali, A. ; Chen, S.H. ; Dias, R.

Author_Institution

Intel Corp., Santa Clara, CA, USA

fYear

1992

fDate

March 31 1992-April 2 1992

Firstpage

24

Lastpage

30

Abstract

Gold thermosonic wire bonding of aluminum pads located on thick polyimide films has been studied. Bond pull and bond shear studies indicated that the weld between the wire and pad was very poor, resulting in unacceptable failure strengths and failure modes. The incorporation of a thin Ti layer between the aluminum and polyimide was found to improve the weld quality and reliability dramatically. This improvement is attributed to the increased bond pad rigidity in the presence of Ti, which allows for a more efficient transfer of the ultrasonic energy to the wire/pad interface.<>

Keywords

aluminium; failure analysis; gold; lead bonding; polymer films; reliability; shear strength; ultrasonic welding; Al-Ti; Al-polyimide multilayer structures; Au thermosonic wire bonding; Au-Al; US energy transfer; bond pad rigidity; bond pull; bond shear; failure modes; failure strengths; reliability; thick polyimide films; weld quality; wire pad weld; Adhesives; Aluminum; Bonding; Dielectrics; Gold; Polyimides; Sputter etching; Very large scale integration; Welding; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium 1992. 30th Annual Proceedings., International

Conference_Location

San Diego, CA, USA

Print_ISBN

0-7803-0473-X

Type

conf

DOI

10.1109/RELPHY.1992.187617

Filename

187617