DocumentCode
2922313
Title
Study of Transistor and Product NBTI Lifetime Distributions
Author
Qin, Jin ; Yan, Baoguang ; Shoshany, Yossi ; Roy, Druker ; Rahamim, Hezi ; Marom, Haim ; Bernstein, Joseph B.
Author_Institution
Reliability Eng., Univ. of Maryland, College Park, MD
fYear
2008
fDate
12-16 Oct. 2008
Firstpage
64
Lastpage
67
Abstract
NBTI has been extensively studied to understand physics of degradation in recent years. However, little has been done to find out the lifetime distributions of NBTI at both transistor and product level, which are important in reliability prediction and improvement. In this paper, Monte-Carlo simulation is carried out to study the NBTI lifetime distribution at transistor level. Lognormal distribution is found to have the best fit. Product level NBTI lifetime distribution is studied through rare event simulation. Result shows that Weibull distribution has a better fit than lognormal distribution at product level. Acceleration test result of 90 nm SRAM cache NBTI degradation is compared with the simulation results and a good agreement is observed.
Keywords
MOSFET; Monte Carlo methods; SRAM chips; Weibull distribution; log normal distribution; semiconductor device reliability; semiconductor device testing; thermal stability; Monte-Carlo simulation; NBTI lifetime distribution; SRAM cache; Weibull distribution; acceleration test; deep submicron CMOS process; lognormal distribution; negative bias temperature instability; rare event simulation; transistor level; Degradation; Discrete event simulation; Equations; Integrated circuit reliability; Life estimation; Niobium compounds; Predictive models; Stress; Titanium compounds; Weibull distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2008. IRW 2008. IEEE International
Conference_Location
S. Lake Tahoe, CA
ISSN
1930-8841
Print_ISBN
978-1-4244-2194-7
Electronic_ISBN
1930-8841
Type
conf
DOI
10.1109/IRWS.2008.4796088
Filename
4796088
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