Mercury porosimetry investigation of plastic, integrated circuit packages

Author

Perreault, G.C. ; Thornton, A.W.

Author_Institution

Cypress Semiconductor, San Jose, CA, USA

fYear

1992

fDate

March 31 1992-April 2 1992

Firstpage

198

Lastpage

204

Abstract

Mercury porosimetry was used to characterize the pores and elastic properties of plastic IC packages. Three types of pores were identified: external gaps, epoxy-metal leadframe pores, and epoxy pores. When intrusion pressure was high enough to fill all pores, porosimetry data were used to calculate elastic constants. Highly accelerated stress test (HAST) and pressure cooker test failures were analyzed the mercury porosimetry techniques. Mercury porosimetry confirmed the existence of epoxy-leadframe pores that had caused failures during HAST testing, but was not effective in detecting die passivation crack failure mechanisms.<>

Keywords

failure analysis; life testing; mercury (metal); monolithic integrated circuits; packaging; porosity; reliability; HAST; Hg porosimetry; epoxy pores; epoxy-metal leadframe pores; external gaps; highly accelerated stress test; integrated circuit packages; intrusion pressure; plastic IC packages; pore detection; porosimetry data; pressure cooker test failures; Failure analysis; Life estimation; Moisture; Passivation; Plastic integrated circuit packaging; Plastic packaging; Semiconductor device packaging; Solids; Stress; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium 1992. 30th Annual Proceedings., International

Conference_Location

San Diego, CA, USA

Print_ISBN

0-7803-0473-X

Type

conf

DOI

10.1109/RELPHY.1992.187646

Filename

187646