A test chip for automatic reliability measurements of interconnect vias

Author

Lippe, K. ; Hasper, A. ; Elfrink, G.W. ; Niehof, J. ; Kerkhoff, H.G.

Author_Institution

MESA Res. Inst., Enschede Univ., Netherlands

fYear

1992

fDate

March 31 1992-April 2 1992

Firstpage

247

Lastpage

250

Abstract

A test circuit for electromigration reliability measurements was designed and tested. The device under test (DUT) is a via-hole chain. The test circuit permits simultaneous measurements of a number of DUTs, and a fatal error of one DUT does not influence the measurement results of the other DUTs. Measurements require only a few measurement instruments. Comparing the measurement results of a single DUT io the measurement results of the test circuit shows that the test circuit may be used for reliability measurements.<>

Keywords

automatic test equipment; electromigration; metallisation; reliability; automatic reliability measurements; electromigration reliability measurements; few measurement instruments; interconnect vias; multilevel interconnects; simultaneous measurements; test chip; test circuit; via-hole chain; Automatic testing; Circuit testing; Current density; Current measurement; Electrical resistance measurement; Semiconductor device measurement; Stress measurement; Temperature; Voltage; Voltmeters;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium 1992. 30th Annual Proceedings., International

Conference_Location

San Diego, CA, USA

Print_ISBN

0-7803-0473-X

Type

conf

DOI

10.1109/RELPHY.1992.187653

Filename

187653