DocumentCode
2928100
Title
Key challenges in practical realization of Si photonics products
Author
Asghari, M. ; Luff, B.J. ; Feng, D. ; Fong, J.
Author_Institution
Kotura Inc., Monterey, CA
fYear
2008
fDate
14-16 Jan. 2008
Firstpage
22
Lastpage
23
Abstract
In this paper we review the key challenges associated with the successful development of Si photonic products. These will include issues such as device performance, wafer fabrication, on chip assembly and product packaging.
Keywords
elemental semiconductors; optical materials; optical waveguides; silicon; Si; Si photonics; chip assembly; product packaging; wafer fabrication; Electronics industry; Etching; Fabrication; Manufacturing; Optical losses; Optical refraction; Optical sensors; Optical variables control; Optical waveguides; Photonics;
fLanguage
English
Publisher
ieee
Conference_Titel
IEEE/LEOS Winter Topical Meeting Series, 2008
Conference_Location
Sorrento
Print_ISBN
978-1-4244-1594-6
Electronic_ISBN
978-1-4244-1595-3
Type
conf
DOI
10.1109/LEOSWT.2008.4444380
Filename
4444380
Link To Document