DocumentCode
2928312
Title
Novel high performances epoxy/anhydride formulations and their application in electrical insulation
Author
Valette, Ludovic ; Jiang, Li Yong ; Ji, Danny ; Karunakaran, Krishnan
fYear
2011
fDate
5-8 June 2011
Firstpage
459
Lastpage
463
Abstract
Epoxy/anhydride formulations are known for their excellent combination of thermo-mechanical properties combined with superior electrical insulation and are widely used in electrical insulation. Such formulations lead to thermosets which demonstrate superior chemical resistance even when exposed to harsh environments. The high cross-linking density combined with the inherent stability of the chemical bonds of the epoxy based network provides cured products with high thermal stability. The use of conventional epoxy/anhydride systems is potentially limited by their relative brittleness. The compositions are especially sensitive to thermal cycling or thermal shock that could result from inadequate processing conditions or in-use aging. The micro-cracks which may be formed during these thermal events drastically reduce the physical and electrical properties of the electrical components. The flexibilization of the epoxy/anhydride network has been used to remedy this issue. Better toughness is then achieved by scarifying the overall thermal stability of the product, i.e. by reducing the glass transition temperature. The objective of this work is to demonstrate that it is possible to greatly enhance the mechanical properties with minimal impact on thermal resistance by using separated toughening agents. After its fundamental evaluation, the new concept was applied to practical formulations used in electrical insulation.
Keywords
bonds (chemical); brittleness; curing; epoxy insulation; fracture toughness; microcracks; thermal resistance; thermal shock; thermal stability; thermomechanical treatment; electrical components; electrical insulation; electrical property; epoxy-anhydride formulations; epoxy-anhydride network; in-use aging; thermal cycling; thermal stability; thermo-mechanical property; Chemicals; Electric shock; Insulation; Silicon compounds; Thermal resistance; Thermal stability;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation Conference (EIC), 2011
Conference_Location
Annapolis, MD
ISSN
pending
Print_ISBN
978-1-4577-0278-5
Electronic_ISBN
pending
Type
conf
DOI
10.1109/EIC.2011.5996198
Filename
5996198
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