• DocumentCode
    2929194
  • Title

    Wireless-compatible optics-free microarray imager

  • Author

    Anwar, Mekhail ; Aytur, Turgut ; Matsudaira, Paul

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Massachusetts Inst. of Technol., Cambridge, MA
  • fYear
    2008
  • fDate
    15-17 Dec. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    We describe a low-cost, wireless compatible biosensor for optical microarray based applications. With the increasing use of microarray platforms in biosensors, as well as high-throughput screening in the areas of research and diagnostics, it has become necessary to develop a low cost imager compatible with existing mu array platforms, enabling microarray technology to be widely utilized outside of a laboratory setting. The incorporation of a wireless interface enables the possibility of a package-free biosensor for direct integration into biological environments. To accomplish this we developed an imaging platform using a standard digital CMOS process that allows direct integration of electronics, while levering the optical properties of silicon photodiodes and quantum dots to eliminate the need for optical filters and lenses, enabling a low-cost integrated solution. As a proof of concept, we demonstrate the detection of a 20 nM concentration of streptavidin without the use of optics.
  • Keywords
    CMOS digital integrated circuits; CMOS image sensors; biochemistry; biosensors; lab-on-a-chip; molecular biophysics; optical sensors; proteins; digital CMOS process; low-cost integrated solution; microarray imager; mu array platform; optics-free optical biosensor; package-free biosensor; quantum dots; silicon photodiode; streptavidin; wireless compatible biosensor; wireless interface; Biomedical optical imaging; Biosensors; CMOS process; CMOS technology; Costs; Electronics packaging; Laboratories; Optical filters; Optical imaging; Standards development;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2008. IEDM 2008. IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    8164-2284
  • Print_ISBN
    978-1-4244-2377-4
  • Electronic_ISBN
    8164-2284
  • Type

    conf

  • DOI
    10.1109/IEDM.2008.4796672
  • Filename
    4796672