DocumentCode
2929194
Title
Wireless-compatible optics-free microarray imager
Author
Anwar, Mekhail ; Aytur, Turgut ; Matsudaira, Paul
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Massachusetts Inst. of Technol., Cambridge, MA
fYear
2008
fDate
15-17 Dec. 2008
Firstpage
1
Lastpage
4
Abstract
We describe a low-cost, wireless compatible biosensor for optical microarray based applications. With the increasing use of microarray platforms in biosensors, as well as high-throughput screening in the areas of research and diagnostics, it has become necessary to develop a low cost imager compatible with existing mu array platforms, enabling microarray technology to be widely utilized outside of a laboratory setting. The incorporation of a wireless interface enables the possibility of a package-free biosensor for direct integration into biological environments. To accomplish this we developed an imaging platform using a standard digital CMOS process that allows direct integration of electronics, while levering the optical properties of silicon photodiodes and quantum dots to eliminate the need for optical filters and lenses, enabling a low-cost integrated solution. As a proof of concept, we demonstrate the detection of a 20 nM concentration of streptavidin without the use of optics.
Keywords
CMOS digital integrated circuits; CMOS image sensors; biochemistry; biosensors; lab-on-a-chip; molecular biophysics; optical sensors; proteins; digital CMOS process; low-cost integrated solution; microarray imager; mu array platform; optics-free optical biosensor; package-free biosensor; quantum dots; silicon photodiode; streptavidin; wireless compatible biosensor; wireless interface; Biomedical optical imaging; Biosensors; CMOS process; CMOS technology; Costs; Electronics packaging; Laboratories; Optical filters; Optical imaging; Standards development;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2008. IEDM 2008. IEEE International
Conference_Location
San Francisco, CA
ISSN
8164-2284
Print_ISBN
978-1-4244-2377-4
Electronic_ISBN
8164-2284
Type
conf
DOI
10.1109/IEDM.2008.4796672
Filename
4796672
Link To Document