DocumentCode
2930127
Title
Rigorous analysis of the characteristic impedance in conductor-backed miniature coplanar waveguides considering multiple layers of lossy and finite thickness metal
Author
Ke Wu ; Vahldieck, R.
Author_Institution
Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
fYear
1992
fDate
1-5 June 1992
Firstpage
987
Abstract
The authors present a complete investigation of realistic conductor-backed miniature coplanar waveguides based on GaAs and alumina substrates. A self-consistent approach is used together with the method of lines to determine characteristic impedances, losses and propagation constants. This analysis is general and includes not only the finite thickness and conductivity of metallization but also the effect of first and second metallic layers and the via-hole location. Results are compared with those obtained with the mode-matching method and published measured data.<>
Keywords
electric impedance; losses; metallisation; microwave integrated circuits; waveguides; Al/sub 2/O/sub 3/ substrate; GaAs; characteristic impedance; conductor-backed miniature coplanar waveguides; losses; metallization; method of lines; multiple layers; propagation constants; self-consistent approach; via-hole location; Conductivity; Conductors; Coplanar waveguides; Dielectric losses; Equations; Impedance; Propagation constant; Propagation losses; Transmission line matrix methods; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1992., IEEE MTT-S International
Conference_Location
Albuquerque, NM, USA
ISSN
0149-645X
Print_ISBN
0-7803-0611-2
Type
conf
DOI
10.1109/MWSYM.1992.188156
Filename
188156
Link To Document