• DocumentCode
    2930127
  • Title

    Rigorous analysis of the characteristic impedance in conductor-backed miniature coplanar waveguides considering multiple layers of lossy and finite thickness metal

  • Author

    Ke Wu ; Vahldieck, R.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
  • fYear
    1992
  • fDate
    1-5 June 1992
  • Firstpage
    987
  • Abstract
    The authors present a complete investigation of realistic conductor-backed miniature coplanar waveguides based on GaAs and alumina substrates. A self-consistent approach is used together with the method of lines to determine characteristic impedances, losses and propagation constants. This analysis is general and includes not only the finite thickness and conductivity of metallization but also the effect of first and second metallic layers and the via-hole location. Results are compared with those obtained with the mode-matching method and published measured data.<>
  • Keywords
    electric impedance; losses; metallisation; microwave integrated circuits; waveguides; Al/sub 2/O/sub 3/ substrate; GaAs; characteristic impedance; conductor-backed miniature coplanar waveguides; losses; metallization; method of lines; multiple layers; propagation constants; self-consistent approach; via-hole location; Conductivity; Conductors; Coplanar waveguides; Dielectric losses; Equations; Impedance; Propagation constant; Propagation losses; Transmission line matrix methods; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 1992., IEEE MTT-S International
  • Conference_Location
    Albuquerque, NM, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-0611-2
  • Type

    conf

  • DOI
    10.1109/MWSYM.1992.188156
  • Filename
    188156