Flip-chip BGA applied high-density organic substrate

Author

Baba, Shinji ; Wu, Qiang ; Hayashi, Eiji ; Watanabe, Masaki ; Matsushima, Hironori ; Tomita, Yoshihiro ; Takemoto, Yoshitaka

Author_Institution

Div. of Manuf. Technol., Mitsubishi Electr. Corp., Hyogo, Japan

fYear

1999

fDate

1999

Firstpage

243

Lastpage

249

Abstract

In the area of high-end logic devices, high pin counts, high speed and high thermal dissipation are strongly required for packages. A Flip-Chip BGA (FC-BGA) has been developed for such requirements. The FC-BGA has successfully realized up to 1681 pin counts and lower crosstalk noise, by using a high-density organic substrate with the 30 μm/30 μm line and spacing width rule and optimizing the substrate layer structure. Furthermore, in order to realize a highly reliable package, the Under Bump Metal (UBM) made of Ni/Cu/Ti for eutectic solder bump was developed and the flux-less bonding process was introduced. The FC-BGA packages applied high-density organic substrate has been developed for leading edge logic devices of networking and computing systems

Keywords

ball grid arrays; flip-chip devices; high-speed integrated circuits; integrated circuit packaging; integrated circuit reliability; integrated logic circuits; microassembling; substrates; 30 micron; Ni-Cu-Ti; crosstalk noise reduction; eutectic solder bump; flip-chip BGA; flux-less bonding process; high pin counts; high speed operation; high thermal dissipation; high-density organic substrate; high-end logic devices; highly reliable package; reliability testing; under bump metal; Assembly; Bonding processes; Computer networks; Costs; Lead; Logic devices; Manufacturing; Packaging; Resins; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

0-7803-5231-9

Type

conf

DOI

10.1109/ECTC.1999.776179

Filename

776179