• DocumentCode
    2935230
  • Title

    Piezoelectric polymer tactile sensor arrays for robotics

  • Author

    Pirolo, David G. ; Kolesar, Edward S.

  • Author_Institution
    USAF Syst. Command, Los Angeles AFB, CA, USA
  • fYear
    1989
  • fDate
    22-26 May 1989
  • Firstpage
    1130
  • Abstract
    Six piezoelectric polymer tactile sensor arrays for robotics have been designed, fabricated, and evaluated for piezoelectric activity and tactile sensing. Two of the arrays were thermally poled. Each consisted of a planar 5*5 arrangement of identical (3 mm*3 mm) discrete sensors made of polyvinylidene fluoride with Al electrodes. PVDF provided a pressure sensing capability. The sensor´s spatial configuration provides information for discerning an object´s shape. The PVDF film was evaluated for two film thicknesses (25 and 40 mu m) and for two versions (unmetallized and vendor-metallized). Two electrode fabrication processes were developed to accommodate the inherent chemical and temperature limitations of the PVDF film. Four array configurations which performed significantly better than the others were square-pad designs that used the 40- mu m thick PVDF film. Two sensor-element spacings (500 and 750 mu m) and electrode-fabrication processes (evaporation and photolithographic) were represented equally in the fabrication of this set.<>
  • Keywords
    ground support equipment; piezoelectric transducers; polymer films; robots; tactile sensors; 25 micron; 40 micron; Al electrodes; aircraft refuelling; electrode fabrication processes; piezoelectric activity; piezoelectric polymer tactile sensor arrays; polyvinylidene fluoride; pressure sensing capability; robotics; spatial configuration; square-pad designs; Chemical sensors; Dry etching; Electrodes; Fabrication; Piezoelectric films; Polymers; Robot sensing systems; Sensor arrays; Shape; Tactile sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace and Electronics Conference, 1989. NAECON 1989., Proceedings of the IEEE 1989 National
  • Conference_Location
    Dayton, OH, USA
  • Type

    conf

  • DOI
    10.1109/NAECON.1989.40351
  • Filename
    40351