Integrated temperature microsensors for characterization and optimization of thermosonic ball bonding process

Author

Mayer, Michael ; Paul, Oliver ; Bolliger, Daniel ; Baltes, H.

Author_Institution

Phys. Electron. Lab., Eidgenossische Tech. Hochschule, Zurich, Switzerland

fYear

1999

fDate

1999

Firstpage

463

Lastpage

468

Abstract

A novel ball bond process optimization method based on a thermal signal from an integrated aluminum microsensor is reported. The in-situ temperature during the ball bonding is measured and analyzed. The ultrasonic period shows distinct features corresponding to the scrubbing of the ball on the pad and the intermetallic bond growth, and the ball deformation by ultrasonic softening. A peak of the signal indicates the end of interconnection growth. This can be used for bond time optimization. When optimizing bonding force, the sensor signal correlates with ball shear strength. Using this method, bonding force process windows can be determined by on-line measurements. Maximum shear strength and maximum microsensor signal were within 20 mN at 34°C. In summary, the method produces a wealth of new insights in transient thermal phenomena of the ball bonding process and promises to simplify the evaluation of ball bonding process windows

Keywords

lead bonding; microsensors; shear strength; temperature sensors; 34 C; Al; integrated aluminum temperature microsensor; intermetallic bond growth; on-line measurement; process optimization; scrubbing; shear strength; thermosonic ball bonding; ultrasonic softening; Aluminum; Bonding forces; Bonding processes; Intermetallic; Microsensors; Optimization methods; Signal processing; Softening; Temperature; Ultrasonic variables measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

0-7803-5231-9

Type

conf

DOI

10.1109/ECTC.1999.776216

Filename

776216