DocumentCode
2936036
Title
High frequency electromagnetic analysis of horizontal grounding conductor and near-by passive parallel conductor within two-layer soil
Author
Arnautovski-Toseva, Vesna ; Grcev, Leonid ; Drissi, Khalil El Khamlichi
Author_Institution
Univ. Ss Cyril & Methodius, Skopje
fYear
2007
fDate
27-29 Sept. 2007
Firstpage
1
Lastpage
5
Abstract
This paper presents the ongoing research results of the high frequency grounding system analysis in two-layer soil structure. On the basis of rigorous electromagnetic field theory, which involves Sommerfeld´s integrals, the mathematical model is formulated by the mixed potential integral equation (MPIE). Detailed analysis of a high frequency performance of a typical horizontal grounding conductor placed in the upper or in the bottom layer is given. It is shown that because of the presence of two distinct layers the current distribution and the impedance to ground are highly affected by the parameters of both soil layers. Also, the current distribution in near-by passive horizontal conductor is analyzed. At the end of the paper some observations about the effects of two-layer soil structure at high frequencies are given.
Keywords
computational electromagnetics; conductors (electric); current distribution; earthing; electromagnetic field theory; integral equations; soil; MPIE; Sommerfeld´s integrals; current distribution; electromagnetic field theory; high frequency electromagnetic analysis; high frequency grounding system analysis; horizontal grounding conductor; mixed potential integral equation; passive parallel conductor; two-layer soil structure; Conductors; Current distribution; Electromagnetic analysis; Electromagnetic field theory; Frequency; Grounding; Integral equations; Mathematical model; Performance analysis; Soil;
fLanguage
English
Publisher
ieee
Conference_Titel
Software, Telecommunications and Computer Networks, 2007. SoftCOM 2007. 15th International Conference on
Conference_Location
Split-Dubrovnik
Print_ISBN
978-953-6114-93-1
Electronic_ISBN
978-953-6114-95-5
Type
conf
DOI
10.1109/SOFTCOM.2007.4446077
Filename
4446077
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