DocumentCode
2936144
Title
Packaging 1000 MIPS for IBM´s S/390 G5 server
Author
Katopis, G.A. ; Backer, W.D. ; Mazzawy, T. ; Stoller, H.
Author_Institution
IBM Corp., Poughkeepsie, NY, USA
fYear
1999
fDate
1999
Firstpage
680
Lastpage
685
Abstract
The new Enterprise model for the S/390 G5 system achieves an off-chip bus speed of 300 MHz using for the first level package a glass ceramic multichip module (MCM) with full field thin film wiring consisting of six polyimide layers and containing a plane pair of signal wiring. A description of the physical attributes of this substrate is presented. In addition, the crucial physical design procedure required for the successful wiring of this MCM is highlighted. Finally, the resulting electrical characteristics of this MCM are summarized
Keywords
IBM computers; ceramic packaging; multichip modules; network servers; wiring; 1000 MIPS; 300 MHz; Enterprise model; IBM S/390 G5 server; electrical characteristics; first level package; full field thin film wiring; glass ceramic multichip module; off-chip bus speed; physical attributes; physical design procedure; plane pair; polyimide layers; signal wiring; CMOS technology; Ceramics; Glass; Packaging; Polyimides; Substrates; Switches; System performance; Transistors; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
0-7803-5231-9
Type
conf
DOI
10.1109/ECTC.1999.776253
Filename
776253
Link To Document