Package and chip-level EMI/EMC structure design, modeling and simulation

Electromagnetic interference (EMI) and electromagnetic compatibility (EMC) issues are generally managed on the subsystem level in today´s electronic systems. With the introduction of compact mixed signal assemblies and mixed signal integrated circuits (IC), EMI/EMC problems have to be solved on the package or chip levels in the near future. Sources, and conductive and radiative interaction mechanisms for representative packages and IC´s are quantified in this paper. Package-to-substrate, chip-to-package, and chip partition-to-partition feedthroughs are identified as one of the key issue. 3D electromagnetic radiative finite element simulations for EMI coupling for representative feedthrough structures are presented. Structures for managing package and chip level EMI/EMC are proposed