• DocumentCode
    2937378
  • Title

    Progress towards developing a web-based virtual packaging laboratory

  • Author

    Light, D. Leigh ; Elshazly, Dina ; May, Gary S.

  • Author_Institution
    Sch. of Electr. & Comput. Eng. & Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    1056
  • Lastpage
    1059
  • Abstract
    A key aspect of the student training process at the Packaging Research Center at the Georgia Institute of Technology is to provide students with hands-on “design, build, and operate” educational opportunities which reach beyond traditional classroom learning. The PRC is in the midst of developing a hands-on instructional laboratory that will provide students with exposure to basic packaging substrate fabrication concepts and techniques, including interconnect design, dielectric deposition, via formation, metallization, and testing. This paper presents a report on progress toward a plan to augment the hands-on packaging instructional laboratory with multimedia presentations and other advanced instructional support technology. The overall vision is to develop a virtual packaging laboratory in which a student can sit at a multimedia computer or workstation (equipped with the necessary audio, video and graphics capability) and follow a substrate through a simple processing sequence. To make this courseware remotely available for potential distance learning applications, it has been developed to be compatible with World-Wide Web access. This virtual packaging laboratory project received seed funding from the IEEE CPMT Society and the National Science Foundation based on a presentation at the 1998 ECTC
  • Keywords
    courseware; distance learning; electronic engineering computing; electronic engineering education; information resources; laboratories; packaging; World Wide Web; courseware; distance learning; education; instructional support technology; multimedia presentation; student training; substrate fabrication; virtual packaging laboratory; Computer vision; Dielectric substrates; Educational technology; Fabrication; Laboratories; Metallization; Packaging; Partial response channels; Testing; Workstations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-5231-9
  • Type

    conf

  • DOI
    10.1109/ECTC.1999.776318
  • Filename
    776318