Thermal Analysis and Design of High-Power LED Street Light

Author

Yang, Kai ; Chen, Yuqing ; Lin, Bin ; Song, Jidong

Author_Institution

Coll. of Opt. & Electron. Technol., China JiLiang Univ., Hangzhou, China

fYear

2010

fDate

19-21 June 2010

Firstpage

1

Lastpage

4

Abstract

LED is called the fourth generation of lighting, which has already been widely used in display and illumination devices. The junction temperature has directly influence upon the life time and reliability of high-power LED, so keeping the junction temperature of LED is a key issue. A method researching radiators based on finite element analysis was introduced. In this paper, the heat performance of LED COB (chip on board) packaging was studied. The radiating model of LED street lamp with a radiator was introduced, and simulated the changing of parameters of radiator by ANSYS.

Keywords

LED lamps; chip-on-board packaging; finite element analysis; street lighting; thermal analysis; LED COB packaging; LED street lamp; chip-on-board packaging; finite element analysis; heat performance; high-power LED street light; illumination devices; lighting; thermal analysis; Electronic packaging thermal management; Energy consumption; Finite element methods; Heat sinks; Heat transfer; LED lamps; Light emitting diodes; Temperature; Thermal conductivity; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Photonics and Optoelectronic (SOPO), 2010 Symposium on

Conference_Location

Chengdu

Print_ISBN

978-1-4244-4963-7

Electronic_ISBN

978-1-4244-4964-4

Type

conf

DOI

10.1109/SOPO.2010.5504439

Filename

5504439