• DocumentCode
    2942140
  • Title

    3-D finite element modeling of SAW sensing system for liquids

  • Author

    Bui, Thu-Hang ; Tien, Dat Nguyen ; Duc, Tung Bui ; Duc, Trinh Chu

  • Author_Institution
    Dept. of Micro Electro Mech. Syst. & Microsyst., Univ. of Eng. & Technol., Hanoi, Vietnam
  • fYear
    2012
  • fDate
    11-14 July 2012
  • Firstpage
    782
  • Lastpage
    787
  • Abstract
    Like emerging devices, surface acoustic wave (SAW) sensors received considerable interest towards their integration within lab-on-chip and microfluidic structures. Rayleigh wave sensors are highly sensitive in detecting properties of gas in contact with their surface including mass change, viscosity, density, velocity and electrical conductivity. In this paper, primarily, a novel structure of Rayleigh surface acoustic wave (R-SAW) sensors for charactering a liquid is presented and sensitivities of the different liquids deposited in the well are compared. The fundamentals of the sensing system using R-SAW sensor on X-cut, Y-propagation Lithium Niobate substrate are described. The numerical simulation results of the wave propagation indicated the important role of the fluid density whereas the viscosity influence is very low.
  • Keywords
    finite element analysis; lab-on-a-chip; microfluidics; surface acoustic wave sensors; 3D finite element modeling; R-SAW sensor; Rayleigh surface acoustic wave sensors; Rayleigh wave sensors; V-propagation lithium niobate substrate; X-cut; density; electrical conductivity; lab-on-a-chip; liquids; mass change; microfluidic structures; numerical simulation; sensitivity; surface acoustic wave sensors; velocity; viscosity; Liquids; Sensors; Substrates; Surface acoustic waves; Viscosity; Acoustic wave sensor; R-SAW sensor; SAW sensor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Intelligent Mechatronics (AIM), 2012 IEEE/ASME International Conference on
  • Conference_Location
    Kachsiung
  • ISSN
    2159-6247
  • Print_ISBN
    978-1-4673-2575-2
  • Type

    conf

  • DOI
    10.1109/AIM.2012.6265882
  • Filename
    6265882