DocumentCode
2943921
Title
A 0.1 /spl mu/m IHLATI (indium halo by large angle tilt implant) nMOSFET for 1.0 V low power application
Author
Young Jin Choi ; Byung-Gook Park ; Jong Duk Lee
Author_Institution
Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
fYear
1997
fDate
23-25 June 1997
Firstpage
16
Lastpage
17
Abstract
As the MOSFET technology is extended into the 0.1 /spl mu/m gate length regime and the supply voltage is scaled to 1-2V, reduction of the threshold voltage (VT) should be pursued more aggressively to obtain sufficient drain current. With scaling down the threshold voltage, it is important to reduce SCE (short channel effect), i.e. DIBL and V/sub T/ roll-off. In this paper, we present an implementation and the device characteristics of O.l/spl mu/m IHLATI (indium halo by large angle tilt implant) nMOSFETs which have excellent resistance to the SCE while maintaining the V/sub T/ very low. We compare the IHLATI nMOSFETs with conventional boron channel nMOSFETs and indium SSR structure nMOSFETs.
Keywords
MOSFET; characteristics measurement; ion implantation; semiconductor technology; 0.1 micron; 1.0 V; DIBL; IHLATI; device characteristics; drain current; large angle tilt implant; low power application; nMOSFET; short channel effect; threshold voltage; Boron; CMOS technology; Degradation; Doping; Fabrication; Implants; Indium; Low voltage; MOSFET circuits; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Device Research Conference Digest, 1997. 5th
Conference_Location
Fort Collins, CO, USA
Print_ISBN
0-7803-3911-8
Type
conf
DOI
10.1109/DRC.1997.612457
Filename
612457
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