• DocumentCode
    2943921
  • Title

    A 0.1 /spl mu/m IHLATI (indium halo by large angle tilt implant) nMOSFET for 1.0 V low power application

  • Author

    Young Jin Choi ; Byung-Gook Park ; Jong Duk Lee

  • Author_Institution
    Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
  • fYear
    1997
  • fDate
    23-25 June 1997
  • Firstpage
    16
  • Lastpage
    17
  • Abstract
    As the MOSFET technology is extended into the 0.1 /spl mu/m gate length regime and the supply voltage is scaled to 1-2V, reduction of the threshold voltage (VT) should be pursued more aggressively to obtain sufficient drain current. With scaling down the threshold voltage, it is important to reduce SCE (short channel effect), i.e. DIBL and V/sub T/ roll-off. In this paper, we present an implementation and the device characteristics of O.l/spl mu/m IHLATI (indium halo by large angle tilt implant) nMOSFETs which have excellent resistance to the SCE while maintaining the V/sub T/ very low. We compare the IHLATI nMOSFETs with conventional boron channel nMOSFETs and indium SSR structure nMOSFETs.
  • Keywords
    MOSFET; characteristics measurement; ion implantation; semiconductor technology; 0.1 micron; 1.0 V; DIBL; IHLATI; device characteristics; drain current; large angle tilt implant; low power application; nMOSFET; short channel effect; threshold voltage; Boron; CMOS technology; Degradation; Doping; Fabrication; Implants; Indium; Low voltage; MOSFET circuits; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference Digest, 1997. 5th
  • Conference_Location
    Fort Collins, CO, USA
  • Print_ISBN
    0-7803-3911-8
  • Type

    conf

  • DOI
    10.1109/DRC.1997.612457
  • Filename
    612457