DocumentCode
2943970
Title
Characterization of inversion layer carrier profile in deep-submicron p-MOSFETs
Author
Bin Yu ; Imai, K. ; Chenming Hu
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
fYear
1997
fDate
23-25 June 1997
Firstpage
22
Lastpage
23
Abstract
In deep-submicron MOSFET, the thickness of gate oxide becomes comparable to that of the inversion layer. The finite inversion layer thickness results in deviation of device parameters from the conventional model. High transverse electric fields at Si/SiO/sub 2/ interface makes quantization effect observable even at room temperature. Several theoretical methods to obtain the inversion layer carrier profile were reported based on quantum mechanics (QM) solution. However a simple electrical method is much preferred. In this paper, a high-frequency small-signal C-V method is proposed to characterize the inversion layer profile in both surface-channel and buried-channel p-MOSFETs based upon the physical concept of dc centroid.
Keywords
MOSFET; carrier density; characteristics measurement; inversion layers; Si-SiO/sub 2/; buried-channel devices; dc centroid; deep-submicron p-MOSFETs; inversion layer carrier profile; quantization effect; small-signal C-V method; surface-channel devices; transverse electric fields; Capacitance-voltage characteristics; Current measurement; Electron devices; Laboratories; MOSFET circuits; National electric code; Quantization; Quantum mechanics; Temperature; Ultra large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Device Research Conference Digest, 1997. 5th
Conference_Location
Fort Collins, CO, USA
Print_ISBN
0-7803-3911-8
Type
conf
DOI
10.1109/DRC.1997.612460
Filename
612460
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