• DocumentCode
    2944180
  • Title

    The knowledge management system for the equipment maintenance technology

  • Author

    Kikuta, Yuko ; Tsutahara, Koichiro ; Kinaga, Toyohiro ; Suzuki, Akihiko ; Tanaka, Hiromi ; Hasegawa, Hiroaki

  • Author_Institution
    Renesas Technol. Corp., Hyogo
  • fYear
    2007
  • fDate
    15-17 Oct. 2007
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    As for the semiconductor manufacture spot, it asks that a equipment doesn´t break down to improve the quality maintenance of the product. However, the product is given a bad influence for the quality, delivery and cost without proper and quick reparation when a equipment breaks down. In order to operate the proper and quick reparation, the system supported the effective use of the technological improvement of the maintenance operator and the information joint ownership such as knowledge, information, experience and know-how of the equipment maintenance has been constructed in (Inc.) Renesas Technology Kumamoto factory. MTTR (mean time to repair average repair time) shortening and effect on a device vendor dependence rate decrease were provided by using this system. From now on, it will aim at more effect by the technological intake of the inside of the office, outside of the office.
  • Keywords
    electronics industry; knowledge management; maintenance engineering; manufacturing data processing; equipment maintenance technology; information joint ownership; knowledge management system; mean time to repair average repair time shortening; quality maintenance; quick reparation; semiconductor manufacture; Costs; Employment; Knowledge management; Manufacturing processes; Manufacturing systems; On the job training; Paper technology; Production engineering; Production facilities; Semiconductor device manufacture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1523-553X
  • Print_ISBN
    978-1-4244-1142-9
  • Electronic_ISBN
    1523-553X
  • Type

    conf

  • DOI
    10.1109/ISSM.2007.4446808
  • Filename
    4446808