Advanced monitoring method for copper interconnect process

Author

Ishikawa, Kensuke ; Ando, Toshio ; Ikota, Masami ; Funakoshi, Tomohiro ; Imai, Yasuo ; Watanabe, Kenji ; Miura, Akihiko ; Ohta, Hideo ; Nemoto, Kazunori ; Onozuka, Toshihiko

Author_Institution

Hitachi Ltd., Tokyo

fYear

2007

fDate

15-17 Oct. 2007

Firstpage

1

Lastpage

4

Abstract

Stabilizing copper interconnect process is the key for yield and reliability improvement. Forming adequate grains in a copper film is so important to have the stable process, but there is no proper method of monitoring grains in a copper film. We introduce an advanced method of monitoring grain size using scattering light that we call the micro-haze method. We verified the effectiveness of the method by the experimental design and concluded that the method makes it possible to monitor grains in a copper film.

Keywords

copper; grain size; integrated circuit interconnections; integrated circuit reliability; integrated circuit yield; process monitoring; scattering; copper interconnect process; grain size; micro-haze method; monitoring method; reliability improvement; scattering light; yield improvement; Atomic force microscopy; Copper; Grain size; Light scattering; Manufacturing; Monitoring; Rough surfaces; Surface roughness; Throughput; Transmission electron microscopy;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on

Conference_Location

Santa Clara, CA

ISSN

1523-553X

Print_ISBN

978-1-4244-1142-9

Electronic_ISBN

1523-553X

Type

conf

DOI

10.1109/ISSM.2007.4446837

Filename

4446837