Development of LCP surface mount package with a bandpass feedthrough at K-band

Author

McGrath, M.P. ; Aihara, K. ; Pham, A.V. ; Nelson, S.

Author_Institution

Microwave Microsystems Laboratory, Department of Electrical and Computer Engineering, University of California Davis, 95616, USA

fYear

2008

fDate

15-20 June 2008

Firstpage

93

Lastpage

96

Abstract

We present the development of thin-film Liquid Crystal Polymer (LCP) surface mount packages with a novel bandpass feedthrough at K-band (18 - 27 GHz). The packages are constructed using multi-layer LCP films and can be surface mounted on a printed circuit board. Our experimental results demonstrate that the bandpass package feedthrough transition including bond wires achieve a return loss of 13 dB or higher and an insertion loss of less than 0.5 dB across K-band. The package transition offers 0.2 dB insertion loss and Gt15 dB return loss across X-band, and operates well across 8 - 27 GHz.

Keywords

liquid crystal polymers; surface mount technology; thin film devices; K-band; LCP surface mount package; X-band; bandpass feedthrough; bond wires; frequency 18 GHz to 27 GHz; loss 13 dB; multi-layer LCP films; printed circuit board; thin-film liquid crystal polymer surface mount packages; Bonding; Coupling circuits; Insertion loss; K-band; Liquid crystal polymers; Millimeter wave technology; Packaging; Printed circuits; Surface waves; Wires; Hermeticity and Ka-band; Liquid Crystal Polymer; Surface Mount Packages;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2008 IEEE MTT-S International

Conference_Location

Atlanta, GA

ISSN

0149-645X

Print_ISBN

978-1-4244-1780-3

Electronic_ISBN

0149-645X

Type

conf

DOI

10.1109/MWSYM.2008.4633111

Filename

4633111