Extending the life of TTL-alignment steppers to 65-nm technology

Author

Yazdání, Nabíl R. ; Apelgren, Eric M. ; Edwards, Richard D. ; Simmons, Michelle A. ; Brown, Stuart E.

Author_Institution

Spansion LLC, Austin

fYear

2007

fDate

15-17 Oct. 2007

Firstpage

1

Lastpage

4

Abstract

When older manufacturing tools are used to run newer technologies in high volume, additional expenditures are often made to either improve controls on those tools, to upgrade the tools, or to purchase newer tools to get the job done. This paper explores the use of older ASML steppers with TTL alignment to achieve overlay metrics that allow them to be used for 65-nm technology, using the existing alignment system to align to the previous layer scribe-line marks, which were intended for more modern off-axis alignment systems. By using this previously untapped capability, costly upgrades or tool replacements are avoided.

Keywords

integrated circuit measurement; integrated circuits; nanotechnology; ASML steppers; TTL-alignment steppers; layer scribe-line marks; manufacturing tools; off-axis alignment systems; overlay metrics; Copper; Costs; Lenses; Paper technology; Production facilities; Production systems; Pulp manufacturing; Scanning probe microscopy; Shape; Throughput;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on

Conference_Location

Santa Clara, CA

ISSN

1523-553X

Print_ISBN

978-1-4244-1142-9

Electronic_ISBN

1523-553X

Type

conf

DOI

10.1109/ISSM.2007.4446874

Filename

4446874