Bulk-Si with poly bump process scheme for MEMS sensors

Author

Chun-Wen Cheng ; Kai-Chih Liang ; Chia-Hua Chu ; Te-Hao Lee ; Jiou-Kang Lee ; Chung-Hsien Lin ; Hsiao Chin Tuan ; Kalnitsky, Alex ; Weileun Fang ; Horsley, David A.

Author_Institution

Taiwan Semicond. Manuf. Co. Ltd., Hsinchu, Taiwan

fYear

2012

fDate

28-31 Oct. 2012

Firstpage

1

Lastpage

4

Abstract

A MEMS process scheme designed for multi- sensors is presented. This new process scheme includes a poly bump not only provides stiction prevention and gap control function, and also electrical connection between MEMS structure and routing lines. Another advantage for this scheme is a better vacuum level because all material can be high temperature annealed before final encapsulation. This study also demonstrated some MEMS devices using this new scheme, including resonators, accelerometers and magnetometers.

Keywords

annealing; elemental semiconductors; encapsulation; microfabrication; microsensors; sensor fusion; silicon; MEMS sensor; Si; accelerometer; electrical connection; encapsulation; gap control function; high temperature annealing; magnetometer; microfabrication; multisensor design; polybump process scheme; resonator; routing line; Accelerometers; CMOS integrated circuits; Magnetic sensors; Magnetometers; Micromechanical devices; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Sensors, 2012 IEEE

Conference_Location

Taipei

ISSN

1930-0395

Print_ISBN

978-1-4577-1766-6

Electronic_ISBN

1930-0395

Type

conf

DOI

10.1109/ICSENS.2012.6411212

Filename

6411212