DocumentCode
2949058
Title
Temperature influence investigation on Hall Effect sensors performance using a lumped circuit model
Author
Paun, Maria-Alexandra ; Sallese, Jean-Michel ; Kayal, Maher
Author_Institution
STI-IEL-Electron. Lab., Ecole Polytech. Fed. de Lausanne (EPFL), Lausanne, Switzerland
fYear
2012
fDate
28-31 Oct. 2012
Firstpage
1
Lastpage
4
Abstract
In order to provide the information on their Hall voltage, sensitivity and drift with temperature, a new simpler lumped circuit model for the evaluation of various Hall Effect sensors has been developed. In this sense, the finite element model associated contains both geometrical parameters (dimensions of the cells) and physical parameters such as mobility, conductivity, Hall factor, carrier concentration and the temperature influence on them. Therefore, a scalable finite element model in Cadence, for integrating in circuit environment CMOS Hall Effect devices with different shapes and technologies and assessing their performance, has been also elaborated.
Keywords
CMOS integrated circuits; Hall effect transducers; finite element analysis; Cadence; Hall effect sensors; Hall factor; Hall voltage; carrier concentration; circuit environment CMOS Hall effect devices; finite element model; lumped circuit model; temperature influence investigation; Hall effect; Integrated circuit modeling; Magnetic sensors; Sensitivity; Temperature dependence; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2012 IEEE
Conference_Location
Taipei
ISSN
1930-0395
Print_ISBN
978-1-4577-1766-6
Electronic_ISBN
1930-0395
Type
conf
DOI
10.1109/ICSENS.2012.6411328
Filename
6411328
Link To Document