Evaluation of polyimides as dielectric materials for multichip packages with multilevel interconnection structure

Author

Lin, A.W.

Author_Institution

AT&T Bell Labs., Murray Hill, NJ, USA

fYear

1989

fDate

22-24 May 1989

Firstpage

148

Lastpage

154

Abstract

An evaluation of nine commercial polyimides for applications in multichip packages with a multilevel interconnection structure is discussed. The evaluation used a temperature-humidity-bias (THB) screening test. DuPont PI2555 performed best under the test condition, exhibiting 85°C/85% RH (relative humidity)/180 V DC bias over 3-mil spacing. A slow increase of leakage current was observed in situ on TiPdAu triple track test samples coated with PI2555. This THB performance was improved by modifying PI2555 with a proprietary additive. However, the thermal stability of PI2555 was degraded by the additive. The dielectric constant of the modified PI2555 was 3.4 at 1 kHz, similar to that of unmodified PI2555

Keywords

environmental testing; hybrid integrated circuits; materials testing; organic insulating materials; packaging; polymer films; 1 kHz; 180 V; 3 mil; 85 degC; DuPont PI2555; TiPdAu triple track test sample; dielectric constant; dielectric materials; leakage current; multichip packages; multilevel interconnection structure; permittivity; polyimides; proprietary additive; relative humidity; temperature-humidity-bias screening test; thermal stability; Additives; Dielectric materials; Humidity; Leakage current; Packaging; Performance evaluation; Polyimides; Testing; Thermal degradation; Thermal stability;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components Conference, 1989. Proceedings., 39th

Conference_Location

Houston, TX

Type

conf

DOI

10.1109/ECC.1989.77741

Filename

77741