Life prediction of BGA and CSP assemblies using an experimental degradation law and FEM simulations

Author

Deletage, J.-Y. ; Fremont, H. ; Louis, P. ; Danto, Y. ; Plano, B. ; Carbonne, B. ; Salagoity, M. ; Faure, C.

Author_Institution

Bordeaux I Univ., Talence, France

fYear

2000

fDate

2000

Firstpage

76

Lastpage

83

Abstract

BGA and CSP packages are now commonly used because of their capabilities to provide more I/O connections than standard leaded SMT components for the same surface. To evaluate the reliability of assemblies using these packages, we propose a life prediction method: it uses a degradation law based on experimental analyses of the evolution of the eutectic microstructure under thermal cycling, and 3D FEM simulations used to determine the maximum strain in the solder joint. The results are compared with an analytical model that provides a fast classification of different assemblies with regard to their thermomechanical behavior

Keywords

ball grid arrays; chip scale packaging; finite element analysis; integrated circuit interconnections; integrated circuit modelling; integrated circuit testing; soldering; stress analysis; thermal stresses; 3D FEM simulation; BGA assemblies; BGA packages; CSP assemblies; CSPs; FEM simulations; I/O connections; assembly classification; degradation law; eutectic microstructure evolution; life prediction; life prediction method; maximum strain; reliability; solder joint; standard leaded SMT components; surface area; thermal cycling; thermomechanical behavior; Analytical models; Assembly; Capacitive sensors; Chip scale packaging; Lead; Microstructure; Prediction methods; Predictive models; Surface-mount technology; Thermal degradation;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 2000. Twenty-Sixth IEEE/CPMT International

Conference_Location

Santa Clara, CA

ISSN

1089-8190

Print_ISBN

0-7803-6482-1

Type

conf

DOI

10.1109/IEMT.2000.910711

Filename

910711