• DocumentCode
    2959660
  • Title

    Current ripple based intelligent pseudo speed measurement for vibration motor in mini-scale production line by the periodic convolution technique

  • Author

    Kuo, Jian-Long ; Wang, Tsung-Yu ; Lee, Jlann-Der

  • Author_Institution
    Dept. of electrical Eng., Chang-gung Univ., Taoyuan
  • fYear
    2004
  • fDate
    26-26 June 2004
  • Firstpage
    323
  • Lastpage
    330
  • Abstract
    In this paper, the vibration motor in the vibrating process control is investigated. A smart pseudo speed sensor technique through detecting the current ripple is suggested. By this approach, the practical speed sensor such as optic encoder is not required. Based on the proposed mathematical transient modeling, the current ripple can be precisely predicted. Periodic convolution is used to derive the inductance for the current ripple. In order to get the detailed information from the current ripple, a transient model to detect the speed condition is required. By observing the frequency of the current ripple, the speed information without using additional speed sensor can be obtained. Such technique can be applied to replace the traditional speed encoder. Therefore, the manufacturing cost for the mini-scale production line can be reduced by the proposed intelligent mechatronical approach
  • Keywords
    convolution; intelligent sensors; mechatronics; process control; production engineering computing; velocity measurement; vibrations; intelligent mechatronical approach; intelligent pseudo speed measurement; miniscale production line; optic encoder; periodic convolution technique; practical speed sensor; smart pseudo speed sensor technique; vibrating process control; vibration motor; Convolution; Intelligent sensors; Mathematical model; Optical sensors; Predictive models; Process control; Production; Velocity measurement; Vibration control; Vibration measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Informatics, 2004. INDIN '04. 2004 2nd IEEE International Conference on
  • Conference_Location
    Berlin
  • Print_ISBN
    0-7803-8513-6
  • Type

    conf

  • DOI
    10.1109/INDIN.2004.1417354
  • Filename
    1417354