DocumentCode
2964977
Title
A survey of thermal decomposition of solid insulations and its relevance to breakdown mechanisms in partial vacuum
Author
Schweickart, D.L.
Author_Institution
Wright Lab., Wright-Patterson AFB, OH, USA
Volume
2
fYear
1995
fDate
3-6 July 1995
Firstpage
1482
Abstract
Several practical issues must be considered when solid electrical insulation is used in a low pressure environment. While the low pressure environment or partial vacuum (in this context, a region which is almost devoid of any gaseous media) can exhibit good electrical insulating properties, the materials contained within the partial vacuum will effect the insulation integrity over time. Degradation of the insulating properties of the partial vacuum may be due to outgassing of enclosed materials and/or adverse media contained in the natural vacuum (space) environment. This paper addresses the thermal degradation of some polymer materials typically used as electrical insulation in partial vacuum. Pyrolysis data for various polymers, from the literature, is discussed. The results of a survey of published pyrolysis data, which identifies the primary gaseous decomposition species for such materials, is presented. The importance of identifying these by-products as they relate to microscopic volume breakdowns and partial discharges is highlighted.
Keywords
electric breakdown; insulation testing; organic insulating materials; partial discharges; polymers; pyrolysis; breakdown mechanisms; electrical insulating properties; insulation integrity; low pressure environment; microscopic volume breakdown; partial discharge; partial vacuum; polymer materials; primary gaseous decomposition species; pyrolysis data; solid electrical insulation; thermal decomposition; Dielectrics and electrical insulation; Electric breakdown; Gas insulation; Microscopy; Partial discharges; Plastic insulation; Polymers; Solids; Thermal decomposition; Thermal degradation;
fLanguage
English
Publisher
ieee
Conference_Titel
Pulsed Power Conference, 1995. Digest of Technical Papers., Tenth IEEE International
Conference_Location
Albuquerque, NM, USA
Print_ISBN
0-7803-2791-8
Type
conf
DOI
10.1109/PPC.1995.599827
Filename
599827
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