• DocumentCode
    2965236
  • Title

    Piezoresistive n-type 4H-SiC pressure sensor with membrane formed by mechanical milling

  • Author

    Akiyama, Terunobu ; Briand, Danick ; De Rooij, Nico F.

  • Author_Institution
    Actuators & Microsyst. Lab. (SAMLAB), Ecole Polytech. Fed. de Lausanne (EPFL), Neuchâtel, Switzerland
  • fYear
    2011
  • fDate
    28-31 Oct. 2011
  • Firstpage
    222
  • Lastpage
    225
  • Abstract
    A 4H-SiC pressure sensor with piezoresistive transducers, for harsh environment applications, e.g., high temperature (~650°C) and/or in corrosive chemicals is presented. The sensing membrane, 1 mm in diameter and 50 μm in thickness, was formed by milling (drilling) a bulk single crystal SiC wafer. Both transverse and longitudinal piezoresistors were formed on the membrane out of an n-type SiC epitaxial layer. Ohmic contacts were obtained with Ta/Ni/Pt metallization followed by annealing at 1000°C for 20 min. The sensor was assembled on a small board and characterized under hydrostatic pressures up to 60 bar at room temperature. The obtained pressure sensitivity was 268 μV/V/bar. The sensor chip was exposed in air at 600°C for 165 hours and changes in bridge resistance were measured.
  • Keywords
    milling; piezoresistive devices; pressure sensors; silicon compounds; SiC; corrosive chemicals; harsh environment applications; mechanical milling; membrane formed; n-type 4H-SiC pressure sensor; piezoresistive transducers; temperature 600 degC; time 165 hour; Annealing; Nickel; Piezoresistive devices; Resistance; Silicon carbide; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2011 IEEE
  • Conference_Location
    Limerick
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4244-9290-9
  • Type

    conf

  • DOI
    10.1109/ICSENS.2011.6126936
  • Filename
    6126936