Surface mount type SAW filter for hand-held telephones

Author

Suma, Shuji ; Gunji, Katsuhiko ; Tagami, Toshio ; Sakamoto, Yoshinobu

Author_Institution

Oki Electr. Ind. Co. Ltd., Tokyo, Japan

Volume

1

fYear

1995

fDate

7-10 Nov 1995

Firstpage

1

Abstract

In the development of a surface mount type SAW filter, we adopted a packaging method to seal a ceramic lid to a laminated ceramic base board by high temperature soldering. The problems of this structure are chip pattern shorts caused by solder splashing during sealing, the heat resistance of bonding pads, and the electromagnetic shielding properties of the package. To solve these problems we created a protective film for the SAW chip, and made the film a heat resistant structure. An electromagnetic shielding property was added by creating a conductive film on the lid

Keywords

UHF filters; assembling; cellular radio; electromagnetic shielding; protective coatings; soldering; surface acoustic wave filters; surface mount technology; EM shielding; SAW filter; bonding pads; ceramic lid; chip pattern shorts; conductive film; electromagnetic shielding properties; hand-held telephones; heat resistance; high temperature soldering; laminated ceramic base board; packaging method; protective film; sealing; solder splashing; surface mount type; Ceramics; Electromagnetic shielding; Packaging; Resistance heating; SAW filters; Seals; Soldering; Surface resistance; Telephony; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium, 1995. Proceedings., 1995 IEEE

Conference_Location

Seattle, WA

ISSN

1051-0117

Print_ISBN

0-7803-2940-6

Type

conf

DOI

10.1109/ULTSYM.1995.495530

Filename

495530