The effects of flux materials on the moisture sensitivity and reliability of flip chip on board assemblies

Author

Beddingfield, Craig ; Higgins, Leo, III

Author_Institution

Adv. Interconnect Syst. Lab., Motorola Inc., Austin, TX, USA

fYear

1997

fDate

13-15 Oct 1997

Firstpage

6

Lastpage

11

Abstract

This paper will discuss the non-proprietary aspects of the work-in-progress regarding developments in flux materials to improve the moisture-induced stress sensitivity of Flip Chip Plastic Ball Grid Array devices. Studies addressing the moisture characterization and pre-conditioning, using JEDEC Level 3, of assemblies built with four proprietary fluxes and two alternative underfill materials will be presented, This report includes the evaluation of the weight loss during a simulated die attach reflow profile for each flux type using thermogravimetric analysis. Also, the underfill adhesion strength to the die surface after assembly, after moisture preconditioning and after 48 hours of autoclave stressing will be discussed. The integrity of the solder joint corresponding to each flux type and measured using die pull techniques will also be presented. The effects of the experimental variables on underfill to die/substrate adhesion will also be reveiwed using C-SAM imaging methods

Keywords

acoustic microscopy; adhesion; flip-chip devices; integrated circuit packaging; moisture; plastic packaging; reflow soldering; reliability; thermal analysis; 48 h; C-SAM imaging methods; JEDEC Level 3; adhesion strength; autoclave stressing; die pull techniques; die/substrate adhesion; flip chip on board assemblies; flux materials; moisture preconditioning; moisture sensitivity; plastic ball grid array devices; pre-conditioning; reliability; simulated die attach reflow profile; solder joint; thermogravimetric analysis; underfill materials; weight loss; Adhesives; Analytical models; Assembly; Electronics packaging; Flip chip; Microassembly; Moisture; Plastics; Soldering; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-3929-0

Type

conf

DOI

10.1109/IEMT.1997.626865

Filename

626865