DocumentCode
2969882
Title
Enabling power distribution network analysis flows for 3D ICs
Author
Hu, Xiang ; Toms, Thomas ; Radojcic, Riko ; Nowak, Matt ; Yu, Nick ; Cheng, Chung-Kuan
Author_Institution
ECE Dept., Univ. of California San Diego, La Jolla, CA, USA
fYear
2010
fDate
16-18 Nov. 2010
Firstpage
1
Lastpage
4
Abstract
This paper concentrates on some of these new challenges that designers must face in power delivery. We will discuss QUALCOMM´s effort with EDA vendors to develop power distribution network (PDN) analysis flows in order to address the power delivery issues in 3DICs, and emphasize the necessity of a standard reduced power model (SRPM) to enable the 3D PDN analysis flows.
Keywords
power integrated circuits; three-dimensional integrated circuits; 3D IC; EDA vendor; QUALCOMM; power delivery; power distribution network analysis flow; standard reduced power model; Frequency domain analysis; Impedance; Integrated circuit modeling; Load modeling; Noise; Three dimensional displays; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
3D Systems Integration Conference (3DIC), 2010 IEEE International
Conference_Location
Munich
Print_ISBN
978-1-4577-0526-7
Type
conf
DOI
10.1109/3DIC.2010.5751433
Filename
5751433
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