Flip-chip-on-board (FCOB) assembly and reliability

Author

Yegnasubramanian, S. ; Deshmukh, R. ; Fulton, J. ; Fanucci, R. ; Gannon, J. ; Morris, J.R. ; Nikmanesh, Khalil

Author_Institution

Lucent Technol., Princeton, NJ, USA

fYear

1997

fDate

13-15 Oct 1997

Firstpage

32

Lastpage

36

Abstract

This paper discusses the methods of direct chip attachment (DCA) and the results of interconnect reliability qualification of flip chip assemblies with underfill. The method developed provides a `dropin´ surface mount process to attach bumped silicon devices to laminates utilizing standard surface mount assembly equipment. Assemblies of test vehicles and product modules demonstrated satisfactory results in all of the reliability qualification and product conformance criteria. Results of failure mode analysis (FMA) of assemblies subjected to thermal stress are discussed

Keywords

assembling; failure analysis; flip-chip devices; integrated circuit interconnections; integrated circuit reliability; laminates; surface mount technology; thermal stresses; FCOB; assembly; direct chip attachment; dropin surface mount process; failure mode analysis; flip-chip-on-board; interconnect reliability qualification; laminates; product conformance criteria; reliability; reliability qualification; standard surface mount assembly equipment; test vehicles; thermal stress; underfill; Assembly; Failure analysis; Flip chip; Laminates; Qualifications; Silicon devices; Standards development; Testing; Thermal stresses; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-3929-0

Type

conf

DOI

10.1109/IEMT.1997.626870

Filename

626870