Wireless power transfer using resonant inductive coupling for 3D integrated ICs

Author

Han, Sangwook ; Wentzloff, David D.

Author_Institution

Electr. Eng. & Comput. Sci. Dept., Univ. of Michigan, Ann Arbor, MI, USA

fYear

2010

fDate

16-18 Nov. 2010

Firstpage

1

Lastpage

5

Abstract

In this paper we introduce a wireless power transfer scheme using resonant inductive coupling for 3DICs to enhance power transfer efficiency and power transfer density with smaller coils. Numerical analysis and optimal conditions are presented for both power transfer efficiency and density. HFSS simulation results are shown to verify the theoretical results. Coils for the power link are designed using a Chartered 0.13μm CMOS process. The peak power transfer efficiency is 52% and power transfer density is 49mW/mm².

Keywords

CMOS integrated circuits; coupled circuits; equivalent circuits; inductive power transmission; numerical analysis; three-dimensional integrated circuits; 3D integrated IC; Chartered CMOS process; HFSS simulation results; numerical analysis; optimal conditions; power link; power transfer density; power transfer efficiency; resonant inductive coupling; size 0.13 mum; wireless power transfer; Coils; Couplings; Equivalent circuits; Integrated circuit modeling; Simulation; Wireless communication; Wireless sensor networks;

fLanguage

English

Publisher

ieee

Conference_Titel

3D Systems Integration Conference (3DIC), 2010 IEEE International

Conference_Location

Munich

Print_ISBN

978-1-4577-0526-7

Type

conf

DOI

10.1109/3DIC.2010.5751455

Filename

5751455