DocumentCode

2970506

Title

Electromigration discussion group summary moderators

Author

Schafft, Harry A. ; Sullivan, Timothy D.

Author_Institution

IBM Microelectronics

fYear

2000

fDate

2000

Firstpage

121

Lastpage

122

Keywords

Electromigration; Life estimation; Metallization; Microelectronics; NIST; Stress; Temperature; Testing; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Integrated Reliability Workshop Final Report, 2000 IEEE International

Print_ISBN

0-7803-6392-2

Type

conf

DOI

10.1109/IRWS.2000.911916

Filename

911916