• DocumentCode
    2976558
  • Title

    Carrier mobility degradation in highly B-doped junctions

  • Author

    Aboy, Maria ; Pelaz, Lourdes ; Lopez, Pedro ; Bruno, E. ; Mirabella, S.

  • Author_Institution
    Univ. de Valladolid, Valladolid
  • fYear
    2009
  • fDate
    11-13 Feb. 2009
  • Firstpage
    34
  • Lastpage
    37
  • Abstract
    Evolution of electrically active dose, sheet resistance and hole mobility has been investigated for high B concentration profiles in pre-amorphized Si. For this purpose, Hall measurements combined with atomistic simulations have been performed. An apparent anomalous behavior has been observed for the evolution of the active dose and the sheet resistance, in contrast to opposite trend evolutions reported previously. Our results indicate that this anomalous behavior is due to large variations in hole mobility with active dopant concentration, much larger than that associated to the classical dependence of hole mobility with carrier concentration. Simulations suggest that hole mobility is significantly degraded by the presence of a large concentration of boron-interstitial clusters, indicating the existence of an additional scattering mechanism.
  • Keywords
    Monte Carlo methods; boron; doping profiles; electrical resistivity; elemental semiconductors; hole density; hole mobility; interstitials; semiconductor doping; semiconductor junctions; silicon; Si:B; apparent anomalous behavior; atomistic simulations; boron-interstitial clusters; carrier concentration; carrier mobility; dopant concentration; hole mobility; junctions; kinetic Monte Carlo simulations; scattering mechanism; sheet resistance; Atomic layer deposition; CMOS technology; Degradation; Dielectric materials; Dielectric substrates; Hafnium oxide; High K dielectric materials; High-K gate dielectrics; Silicon; Thickness control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices, 2009. CDE 2009. Spanish Conference on
  • Conference_Location
    Santiago de Compostela
  • Print_ISBN
    978-1-4244-2838-0
  • Electronic_ISBN
    978-1-4244-2839-7
  • Type

    conf

  • DOI
    10.1109/SCED.2009.4800423
  • Filename
    4800423