DocumentCode
2983095
Title
Simulation of Thermal Characteristics for Helical Slow-Wave Circuit of TWT
Author
Yao, Lieming ; Yang, Zhonghai ; Huo, Zhongsheng ; Zhu, Xiaofang ; Li, Bin
Author_Institution
Univ. of Electron. Sci. & Technol. of China, Chengdu
fYear
2007
fDate
18-21 April 2007
Firstpage
1
Lastpage
3
Abstract
A simulated model has been established to calculate the temperature of helical slow-wave circuits accurately. The Finite Element Method software ANSYS was used to analyze the thermal distortion of the helical slow-wave circuit of TWT. The thermal analysis results show the thermal stress makes helical tape concave at the positions contacting with rods and convex at the part between the two rods, and the expansion of the helical tape width and thickness are very small and could be ignored. The effect of thermal strain in helical slow-wave circuit on TWT cold-test characteristics was analyzed in detail. The quasi-periodic boundary conditions in the computer code MAFIA was employed to determine the effect on dispersion and on-axis interaction impedance of helical slow-wave circuit. With the helix temperature getting higher, the phase velocity decreases obviously and the interaction impedance varieties slightly.
Keywords
electronic engineering computing; finite element analysis; slow wave structures; ANSYS; TWT; finite element method; helical slow-wave circuit; quasiperiodic boundary conditions; thermal distortion; Boundary conditions; Circuit analysis computing; Circuit simulation; Dispersion; Impedance; RLC circuits; Temperature; Thermal expansion; Thermal stresses; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave and Millimeter Wave Technology, 2007. ICMMT '07. International Conference on
Conference_Location
Builin
Print_ISBN
1-4244-1049-5
Electronic_ISBN
1-4244-1049-5
Type
conf
DOI
10.1109/ICMMT.2007.381439
Filename
4266198
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