• DocumentCode
    2983622
  • Title

    Elastic interconnects: repeater-inserted long wiring capable of compressing and decompressing data

  • Author

    Mizuno, M. ; Dally, W.J. ; Onishi, H.

  • Author_Institution
    NEC Corp., Kanagawa, Japan
  • fYear
    2001
  • fDate
    7-7 Feb. 2001
  • Firstpage
    346
  • Lastpage
    347
  • Abstract
    The RC delay of an interconnect is a critical parameter that does not improve with process scaling, but rather increases. Interconnect delay considerably degrades the performance of today´s sophisticated microprocessors, so much work has been done to reduce both this delay and its influence on performance . In a chip multiprocessor, process scaling would improve the intrinsic speed of each processor tile, but overall chip speed would not increase because of the limits to communication between tiles. The communication performance is limited by not only RC-delay increase but also arising network congestion and contention. Regarding the latter, effective use is made of network techniques developed in both interconnection networks for off-chip multiprocessors and communication networks for packet switching. This elastic interconnect for internal communications on-chip multiprocessors is a fundamental technique capable of enhancing conventional network techniques by effectively utilizing on-chip repeater-inserted long wiring.
  • Keywords
    RC circuits; delays; integrated circuit interconnections; microprocessor chips; repeaters; wiring; RC delay; elastic interconnects; interconnect delay; interconnection networks; internal communications; microprocessors; network congestion; overall chip speed; packet switching; process scaling; repeater-inserted long wiring; Communication networks; Degradation; Delay; Microprocessors; Multiprocessor interconnection networks; Network-on-a-chip; Packet switching; Repeaters; Tiles; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2001. Digest of Technical Papers. ISSCC. 2001 IEEE International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0193-6530
  • Print_ISBN
    0-7803-6608-5
  • Type

    conf

  • DOI
    10.1109/ISSCC.2001.912667
  • Filename
    912667