DocumentCode
2984734
Title
Degradation Mechanisms in SiC Bipolar Junction Transistors
Author
Qingchun Zhang ; Jonas, C. ; Agarwal, A. ; Muzykov, P. ; Sudarshan, T. ; Geil, B. ; Scozzie, C.
Author_Institution
Cree Inc., Research Triangle Park, NC
fYear
2008
fDate
23-25 June 2008
Firstpage
285
Lastpage
286
Abstract
SiC power bipolar junction transistors (BJTs) are believed to have the potential of operating reliably at much higher junction temperatures as compared to SiC MOSFETs. The obstacle for commercialization of SiC BJTs is the presence of degradation in both on-resistance and current gain, first detected by Agarwal et al. The recombination-induced stacking faults (SFs) were a prime suspect but no clear experimental proof was provided. In this paper, for the first time, we provide an experimental evidence of the recombination- induced SFs in SiC BJTs, and correlation with device characteristics.
Keywords
power bipolar transistors; silicon compounds; wide band gap semiconductors; SiC; SiC power bipolar junction transistors; degradation mechanisms; recombination-induced stacking faults; Conductivity; Degradation; MOSFETs; Milling machines; Powders; Silicon carbide; Spontaneous emission; Stacking; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Device Research Conference, 2008
Conference_Location
Santa Barbara, CA
ISSN
1548-3770
Print_ISBN
978-1-4244-1942-5
Type
conf
DOI
10.1109/DRC.2008.4800841
Filename
4800841
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