• DocumentCode
    2984734
  • Title

    Degradation Mechanisms in SiC Bipolar Junction Transistors

  • Author

    Qingchun Zhang ; Jonas, C. ; Agarwal, A. ; Muzykov, P. ; Sudarshan, T. ; Geil, B. ; Scozzie, C.

  • Author_Institution
    Cree Inc., Research Triangle Park, NC
  • fYear
    2008
  • fDate
    23-25 June 2008
  • Firstpage
    285
  • Lastpage
    286
  • Abstract
    SiC power bipolar junction transistors (BJTs) are believed to have the potential of operating reliably at much higher junction temperatures as compared to SiC MOSFETs. The obstacle for commercialization of SiC BJTs is the presence of degradation in both on-resistance and current gain, first detected by Agarwal et al. The recombination-induced stacking faults (SFs) were a prime suspect but no clear experimental proof was provided. In this paper, for the first time, we provide an experimental evidence of the recombination- induced SFs in SiC BJTs, and correlation with device characteristics.
  • Keywords
    power bipolar transistors; silicon compounds; wide band gap semiconductors; SiC; SiC power bipolar junction transistors; degradation mechanisms; recombination-induced stacking faults; Conductivity; Degradation; MOSFETs; Milling machines; Powders; Silicon carbide; Spontaneous emission; Stacking; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference, 2008
  • Conference_Location
    Santa Barbara, CA
  • ISSN
    1548-3770
  • Print_ISBN
    978-1-4244-1942-5
  • Type

    conf

  • DOI
    10.1109/DRC.2008.4800841
  • Filename
    4800841