DocumentCode
2989755
Title
Progress of research in MEMS packaging in China
Author
Liu, Sheng
Author_Institution
Inst. of Microsystems, Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear
2003
fDate
28-30 Oct. 2003
Firstpage
181
Lastpage
183
Abstract
A review of the MEMS packaging research in China is made in terms of the major research institutions, equipment, and research topics. The author also discusses the future plans of China in MEMS and MEMS packaging in the next two to three years.
Keywords
electronics packaging; micromechanical devices; China MEMS packaging research; MEMS research institutions; packaging equipment; Bonding; Electronics packaging; Information technology; Materials reliability; Microelectronics; Micromechanical devices; Packaging machines; Software packages; Temperature sensors; Welding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location
Shanghai, China
Print_ISBN
0-7803-8168-8
Type
conf
DOI
10.1109/EPTC.2003.1298720
Filename
1298720
Link To Document