• DocumentCode
    2990277
  • Title

    New anisotropic conductive film (ACF)

  • Author

    Yokoyama, Akinori ; Maehara, Kazuo ; Takagi, Kazuo

  • Author_Institution
    LCT Project, Asahikasei Corporation, Shizuoka, Japan
  • fYear
    2003
  • fDate
    28-30 Oct. 2003
  • Firstpage
    302
  • Lastpage
    305
  • Abstract
    Asahikasei has originally developed the new conductive powder AMG/sup R/ which has a specific structure mainly composed of copper and a small amount of silver, wherein its particle´s surface is quite rich in silver component in spite of containing a small amount of silver throughout the particle. The configuration of AMG are summarized here: (1) the Cu-Ag alloy powder is mainly composed of copper and a small amount of silver; (2) the particle surface is rich in silver component; (3) the shape is nearly spherical. Thanks to this specific structure, AMG shows excellent performance, such as high electroconductivity due to its composition of copper and silver, excellent reliability and less ion-migration because of its specific structure when applied to ACF.
  • Keywords
    circuit reliability; copper alloys; electrical conductivity; electromigration; electronics packaging; filled polymers; particle reinforced composites; silver alloys; AMG conductive powder; CuAg; anisotropic conductive film; copper-silver powder structure; electroconductivity; ion-migration; near-spherical shape; reliability; silver component-rich particle surface; Bonding; Conductive films; Conductivity; Contact resistance; Copper; Gold; Nickel; Powders; Shape memory alloys; Silver;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
  • Conference_Location
    Shanghai, China
  • Print_ISBN
    0-7803-8168-8
  • Type

    conf

  • DOI
    10.1109/EPTC.2003.1298744
  • Filename
    1298744