Experimental research on reliability of reflowed through-hole solder joints

Author

Ding, Y. ; Wang, C.Q. ; Tian, Y.H.

Author_Institution

State Key Lab. of Adv. Welding Production Technol., Harbin, China

fYear

2003

fDate

28-30 Oct. 2003

Firstpage

377

Lastpage

380

Abstract

An analysis on reliability of through hole solder joints under thermal shock was carried out in this paper. Compared with the traditional wave soldered joints, the response of reflow soldered joints to the thermal fatigue test were studied in non-destructive and destructive ways. Cracks were caused in solder joints by the coefficient of thermal expansion (CTE) mismatch. And the cracking extent in the reflow soldered joints were dissimilar to that in the wave soldered joints due to the difference of solder joint shape. Furthermore, the failure mechanics of solder joints were analyzed thoroughly.

Keywords

failure analysis; reflow soldering; reliability; thermal expansion; thermal shock; thermal stress cracking; CTE mismatch; coefficient of thermal expansion; failure mechanics; reflowed through-hole solder joints; solder joint cracking; solder joint reliability; solder joint shape; thermal fatigue test; thermal shock; wave soldered joints; Electric shock; Fatigue; Joining materials; Performance evaluation; Shape; Soldering; Temperature; Testing; Thermal loading; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on

Conference_Location

Shanghai, China

Print_ISBN

0-7803-8168-8

Type

conf

DOI

10.1109/EPTC.2003.1298764

Filename

1298764